WATD (Wafer Assembly TD) Wet Etch Equipment Engineer
Company: Intel
Location: Cheyenne
Posted on: May 26, 2023
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Job Description:
Job Description
Microelectronic Packaging Equipment Engineers are semiconductor
equipment engineering owners. Responsible and accountable for
equipment installations, qualifications, product matching, quality
assurance. and performance. Engineers are responsible for the
thermal/mechanical/electrical design, analysis, and development of
electronic packages. Defines overall package performance and
specification and realizes technology certification through layout
design and test vehicle design. Conducts tests and research on
basic materials and properties. Establishes material specifications
for contract assemblers and raw material vendors and interfaces
with Quality Assurance and Purchasing regarding material quality
and vendor performance. Provides consultation concerning packaging
problems and improvements in the packaging process. Responds to
customer/client requests or events as they occur. Develops
solutions to problems utilizing formal education, experience and
judgment.
Qualifications
You must possess the below minimum qualifications to be initially
considered for this position.
Preferred qualifications are in addition to the requirements and
are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through
a combination of your school work and/or classes and/or research
and/or relevant previous job and/or internship experiences .
Minimum Requirements:
BS degree or higher in Engineering or related discipline
12+ Years in semiconductor equipment experience.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make
every facet of semiconductor manufacturing state-of-the-art -- from
semiconductor process development and manufacturing, through yield
improvement to packaging, final test and optimization, and world
class Supply Chain and facilities support. Employees in the
Technology Development and Manufacturing Group are part of a
worldwide network of design, development, manufacturing, and
assembly/test facilities, all focused on utilizing the power of
Moore's Law to bring smart, connected devices to every person on
Earth.
Covid Statement
Intel strongly encourages employees to be vaccinated against
COVID-19. Intel aligns to federal, state, and local laws and as a
contractor to the U.S. Government is subject to government mandates
that may be issued. Intel policies for COVID-19 including guidance
about testing and vaccination are subject to change over time.
Posting Statement
All qualified applicants will receive consideration for employment
without regard to race, color, religion, religious creed, sex,
national origin, ancestry, age, physical or mental disability,
medical condition, genetic information, military and veteran
status, marital status, pregnancy, gender, gender expression,
gender identity, sexual orientation, or any other characteristic
protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in
the industry. It consists of competitive pay, stock, bonuses, as
well as, benefit programs which include health, retirement, and
vacation. Find more information about all of our Amazing Benefits
here:
https://www.intel.com/content/www/us/en/jobs/benefits.html
Working Model
This role will be eligible for our hybrid work model which allows
employees to split their time between working on-site at their
assigned Intel site and off-site. In certain circumstances the work
model may change to accommodate business needs.
Keywords: Intel, Cheyenne , WATD (Wafer Assembly TD) Wet Etch Equipment Engineer, Engineering , Cheyenne, Wyoming
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